The assurance of reliability is closely bound to detect and investigate errors and defects. The non-destructive of hidden faults allows the determination of the condition of samples without impairing their functionality and is thus also suitable for quality assurance in the production and maintenance of systems during operation.
The selection of suitable measuring methods for the non-destructive testing is big. Our methods are imaging and non-destructive and make use of the optical properties of heat and heat flux. We help you make the right choice.
Using transient methods based on infrared thermography, hidden errors can be detected and localized. By means of high-quality optics, the resolution of structures below 10 ?m is possible, close to the physical limit caused by infrared wavelengths. Available methods include:
- Pulse thermography
- Pulse phase thermography
- Lock-in thermography
The only problem: samples usually have to be blackened. This is done by means of a special optical lacquer which can be completely removed by rinsing with alcohol.
Reflective surfaces and specimens, which must not be lacquered, represent an insurmountable obstacle to the measurement using infrared-based methods. Thermoreflectance thermography uses the temperature dependence of the reflectivity of reflecting or sufficiently smooth surfaces and does not require any surface treatment. This makes the thermoreflectance a non-destructive test method par excellence.
From the determination of temperature fields on the surface to the detection of smallest errors, the thermoreflectance thermography offers the same applications as infrared thermography. By using shorter wavelengths for excitation and measurement, up to ten times smaller structure widths can be solved than with infrared-based methods. A few advantages of thermoreflectance thermography at a glance:
- High spatial resolution (up to 500 nm)
- No temperature limits
- No painting or other surface treatment necessary
Scanning Acoustic Microscopy
A well-established method is the investigation of solid samples using ultrasonic waves. Ultrasonic microscopy detects hidden interfaces and can depict them with high contrast. The samples must be measured under DI water in order to ensure an optimum sound coupling. For most samples, however, this is not a problem and allows fast test results with high reliability.
Transient thermal analysis
The transient analysis of packages, also known as thermal impedance spectroscopy, is a non-destructive testing method without imaging that provides insight into the thermal path of an assembly. Especially in the context of quality assurance, this method is of great advantage since slight changes in the heat flow, which result, for example, by microcrack evolution, can already be recognized and located.
|Infrared||no limitations||resolution up to 10 µm|
frame rates up to 10 kHz
|blackening the surface |
|Thermoreflectance||reflective surfaces||resolution up to 500nm|
image rates up to 100 Hz
only after calibration
|Ultrasound||no restrictions||fast and realiable||test is performed under |
|Transient Th. Analysis||packages and systems||thermal path resolution||active component required|
We offer a wide-ranging selection of non-destructive and mostly imaging analysis methods whose use has contributed valuable results in numerous projects. Present your samples, and we will perform suitable analyses for you.
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