Metals and Substrates

Thermal Characterization


Thermal characterization of solids is bearing diverse challenges. Depending on the material class high thermal conductivities are to be determined, thin layers to be characterized or anisotropy to be considered. For each material we have the due method and the right system.

Metals and Alloys

Challenging about the characterization of metals and alloys are considerably high thermal conductivities of most of the materials. Common steady state methods are eligible for low conductivities only and alternative transient methods don't provide the thermal conductivity as result, but the diffusivity only.

We developed the measurement system LaTIMA™ which qualifies thermal conducitivity determination by means of steady state methods for high values. Hence, in addition to thermal diffusivity measurements we offer the reliable thermal conductivity determination of all kinds of solid metals and alloys.

Circuit Board Substrates

Characterizing circuit board substrates requires understanding of the targeted application. Which responsibility the board has to bear dictates the intensity of thermal investitagtions. In many cases anisotropic properties to be considered and also the transient behavior is influential in terms of reliability. From simple through-plane thermal conductivity determination to transient thermal analyses to heat spreading investigations - we provide thermal insights into your substrates.

Semiconductors

During the development of new processing technologies or the advancement of established processes the thermal properties of a semiconductor provide a significant quality criterion. The thermal performance of the material is a decisive factor towards the target application's reliability and has to be dependably guaranteed. We provide the determination of thermal conductivity and diffusivity of all common semiconductor materials. As single order or process-accompanying.

Thin Layers

Only few measurement system allow reliable thermal testing of thin layers. Laserflash system promise much, especially with regard to a wide range of feasible material classes. Though, available systems usually fail at high thermally conductive and thin layers - samples that are increasingly relevant in electronics. Because of that, we use a high performance laser with pulse widths in nanosecond range. Using this excitation source, determination of the diffusivity of thin to very thin layers is no problem anymore - and our offer to you.

Laminates

The thermal interface resistance between two joint solid materials can occasionally range in same the order as the actual thermal resistance through the two joint materials. This interface property therefore is essential to characterize. Besides the effective overall diffusivity of the compound material laserflash analysis also offers insights about the interface resistance between the joint materials. Don't let phase boundaries set boundaries to you. We will assist.


Your benefits:

  • Thermal characterization of anisotropic materials
  • Scientific precision
  • Swift and straightforward service
  • Reliable, reproducible and comparable
  • Comprehensive technical briefing


Your personal contact:

Contact Portrait

Dan Wargulski

Research & Development